Application module: Layered interconnect module design ISO/TS 10303-1698:2018-11(E)
© ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
    3.1 Terms and definitions
    3.2 Abbreviated terms

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM constant definitions
   4.3 ARM type definitions
   4.4 ARM entity definitions
   4.5 ARM subtype constraint definitions
   4.6 ARM function definitions
   4.7 ARM rule definition
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM type definitions
     5.2.2 MIM entity definitions
     5.2.3 MIM subtype constraint definitions

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
F Change history
Bibliography
Index

Mapping tableIndex of EXPRESS-G pagesFirst pagePrevious pageNext pageLast page
Figure C.5 — ARM entity level EXPRESS-G diagram 4 of 14 ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.material_removal_feature_template_or_parametric_template ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.stratum_feature_template_component_or_stratum ./armexpg3.htm ./armexpg11.htm ./armexpg11.htm ./armexpg7.htm ./armexpg11.htm ./armexpg3.htm ./armexpg11.htm ./armexpg4.htm ./armexpg6.htm ./armexpg3.htm ./armexpg6.htm ../layered_interconnect_simple_template/sys/4_info_reqs.htm#layered_interconnect_simple_template_arm.electrical_isolation_removal_template ../part_template/sys/4_info_reqs.htm#part_template_arm.template_definition ../assembly_component/sys/4_info_reqs.htm#assembly_component_arm.assembly_component ../layered_interconnect_simple_template/sys/4_info_reqs.htm#layered_interconnect_simple_template_arm.material_removal_feature_template ../external_item_identification_assignment/sys/4_info_reqs.htm#external_item_identification_assignment_arm.external_source_identification ../product_occurrence/sys/4_info_reqs.htm#product_occurrence_arm.single_instance ../layered_interconnect_simple_template/sys/4_info_reqs.htm#layered_interconnect_simple_template_arm.parametric_template ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.electrical_isolation_laminate_component ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.material_removal_laminate_component ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.interface_access_material_removal_laminate_component ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.fiducial ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.laminate_component ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.multi_layer_material_removal_laminate_component ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.limd_assembly_component_subtypes


Figure C.5 — ARM entity level EXPRESS-G diagram 4 of 14


© ISO 2018 — All rights reserved