Application module: Layered interconnect module with printed component design ISO/TS 10303-1700:2018-11(E)
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Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
    3.1 Terms and definitions
    3.2 Abbreviated terms

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM type definitions
   4.3 ARM entity definitions
   4.4 ARM subtype constraint definitions
   4.5 ARM function definitions
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM type definition
     5.2.2 MIM entity definitions
     5.2.3 MIM subtype constraint definitions

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
F Change history
Bibliography
Index

Mapping tableIndex of EXPRESS-G pagesFirst pagePrevious page
Figure D.2 — MIM entity level EXPRESS-G diagram 1 of 1 ../layered_interconnect_module_with_printed_component_design/sys/5_mim.htm#layered_interconnect_module_with_printed_component_design_mim.limwpcd_external_identification_item ../assembly_component/sys/5_mim.htm#assembly_component_mim.assembly_component ../assembly_component/sys/5_mim.htm#assembly_component_mim.assembly_component ../layered_interconnect_module_design/sys/5_mim.htm#layered_interconnect_module_design_mim.structured_layout_component ../layered_interconnect_module_design/sys/5_mim.htm#layered_interconnect_module_design_mim.structured_layout_component ../external_item_identification_assignment/sys/5_mim.htm#external_item_identification_assignment_mim.external_identification_item ../layered_interconnect_module_with_printed_component_design/sys/5_mim.htm#layered_interconnect_module_with_printed_component_design_mim.single_stratum_printed_component ../layered_interconnect_module_with_printed_component_design/sys/5_mim.htm#layered_interconnect_module_with_printed_component_design_mim.tiebar_printed_component ../layered_interconnect_module_with_printed_component_design/sys/5_mim.htm#layered_interconnect_module_with_printed_component_design_mim.basic_multi_stratum_printed_component ../layered_interconnect_module_with_printed_component_design/sys/5_mim.htm#layered_interconnect_module_with_printed_component_design_mim.multi_stratum_printed_component ../layered_interconnect_module_with_printed_component_design/sys/5_mim.htm#layered_interconnect_module_with_printed_component_design_mim.printed_connector_component ../layered_interconnect_module_with_printed_component_design/sys/5_mim.htm#layered_interconnect_module_with_printed_component_design_mim.routed_transmission_line ../layered_interconnect_module_with_printed_component_design/sys/5_mim.htm#layered_interconnect_module_with_printed_component_design_mim.printed_component ../layered_interconnect_module_with_printed_component_design/sys/5_mim.htm#layered_interconnect_module_with_printed_component_design_mim.limwpcd_assembly_component_subtypes ../layered_interconnect_module_with_printed_component_design/sys/5_mim.htm#layered_interconnect_module_with_printed_component_design_mim.limwpcd_structured_layout_component_subtypes


Figure D.2 — MIM entity level EXPRESS-G diagram 1 of 1


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