Application module: Fabrication technology ISO/TS 10303-1670:2018-11(E)
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Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
    3.1 Terms and definitions
    3.2 Abbreviated terms

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM type definitions
   4.3 ARM entity definitions
   4.4 ARM function definitions
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM type definitions
     5.2.2 MIM entity definitions
     5.2.3 MIM subtype constraint definitions

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
F Change history
Bibliography
Index

3 Terms, definitions and abbreviated terms

3.1 Terms and definitions

3.1.1 Terms defined in ISO 10303-1

For the purposes of this document, the following terms defined in ISO 10303-1 apply:

3.1.2 Terms defined in IEC 60050-541

For the purposes of this document, the following terms defined in IEC 60050-541 apply:

3.1.3 Other terms and definitions

For the purposes of this document, the following terms and definitions apply:

3.1.3.1
B-stage

intermediate stage in the reaction of a thermosetting resin in which the material melts when heated and dissolves in certain solvents

3.1.3.2
C-stage

final stage of the curing of a thermosetting resin in which the material has become infusible and insoluble in common solvents

3.1.3.3
conformal coat

protective, dielectric coating designed to conform to the surface of a PWA or PCA

3.1.3.4
glue mask

rigid plate with a pattern of voids to create glue patterns during a manufacturing process

3.1.3.5
laminate

product made by bonding together two or more layers of material or materials

3.1.3.6
paste mask

rigid plate with a pattern of voids used to create solder paste patterns during a manufacturing process. Solder paste is deposited only where there are voids in the plate

3.1.3.7
preimpregnated

combination of mat, fabric, nonwoven material, or roving with resin, usually advanced to the B-stage, ready for curing

3.1.3.8
semi-cured

B-stage

3.1.3.9
semi-fluid

material flow properties intermediate between liquids and solids

3.1.3.10
silkscreen

material layer realized by transferring an image to a surface by forcing suitable media through a stencil screen with a squeegee

3.1.3.11
solder mask

insulating layer of a PCB or PWB that exposes only the areas to be soldered

3.1.3.12
solder paste

specially blended paste consisting of carefully graded solder powder particles, and a flux medium designed to give the paste particular printing and reflow characteristics

3.1.3.13
stratum

layer of material in the sequence of materials that compose a PCB, and that usually has an aspect ratio that is very large, typically 1,000:1

3.2 Abbreviated terms

For the purposes of this document, the following abbreviated terms apply:

AM application module
AP application protocol
ARM application reference model
MIM module interpreted model
PCA Printed Circuit Assembly
PCB Printed Circuit Board
prepreg preimpregnated
PWA Printed Wiring Assembly
PWB Printed Wiring Board
URL uniform resource locator


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